The new platform presents Harwin’s components in an interactive 3D environment, allowing users to rotate and inspect products ...

Renesas Electronics has developed three new system‑on‑chip (SoC) technologies designed to power the next generation of ...

With the dynamic growth and ubiquity of electronic systems globally, software-defined, AI-powered, and silicon-enabled technologies are critical for today’s semiconductor industry, which is projected ...

HAETAE is positioned as a flagship partnership linking European photonics laboratories with advanced semiconductor specialists in South Korea. Moralis said the initiative reflects a wider trend ...

Nvidia agrees multiyear agreement to provide Meta Platforms with millions of its current and next‑generation AI chips.

ROHM has added a new compact package option to its range of 40V and 60V automotive MOSFETs, targeting applications such as main inverter control circuits, electric pumps and LED headlights. The latest ...

STMicroelectronics has introduced two new automotive‑grade isolated gate drivers for EV and hybrid vehicle systems.

TASKING has unveiled new upgrades to its unified development toolchain aimed at improving worst‑case timing and coupling analysis for real‑time multicore embedded systems used in safety‑critical ...

Renesas Electronics has announced a new ternary content‑addressable memory (TCAM) technology built on a 3nm FinFET process.

Air quality measurement is a critical way to ensure the health and safety of both indoor and outdoor environments.

Amphenol RF has added new MMCX cable assembly options to its product line, introducing both straight and right‑angle plug ...